Thermal Management Solutions Using Electron Tunneling Through a Nano‐Scale Vacuum Gap

Tavkhelidze, A. and Taliashvili, Z. and Bibilashvili, A. and Tsakadze, L. and Jangidze, L. and Skhiladze, G. and Cox, I and Magdych, J. (2004) Thermal Management Solutions Using Electron Tunneling Through a Nano‐Scale Vacuum Gap. In: AIP Conf. Proc. Volume 699.

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Abstract

Requirements for cooling and power consumption in space platforms are subject to significantly greater constraints than the requirements for terrestrial applications. Existing cooling systems incorporate various mechanisms including thermoelectric (Peltier) cooling elements, radiative cooling, and phase‐change compressor‐based systems. This paper outlines an alternative mechanism currently in development called “thermotunneling”. This mechanism exploits electron tunneling across a vacuum gap of ∼10nm to effect a temperature differential with high efficiency. When complete, these devices (“Cool Chips”) are expected to offer a compact, lightweight, low maintenance and highly efficient (in excess of 50% of Carnot Efficiency) thermal management solution ideally suited for the needs of aerospace applications. This article was originally published with an incorrect list of authors which is now corrected.

Item Type:	Conference or Workshop Item (Paper)
Subjects:	T Technology > T Technology (General)
Divisions:	Faculties/Schools > School of Natural Sciences and Engineering
Depositing User:	Professor Avtandil Tavkhelidze
Date Deposited:	05 May 2014 12:52
Last Modified:	02 Apr 2015 08:09
URI:	http://eprints.iliauni.edu.ge/id/eprint/1423

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