Liquid metal contact as possible element for thermotunneling

Tavkhelidze A, Tsakadze L, Taliashvili Z, Jangidze L., Cox I (2013) Liquid metal contact as possible element for thermotunneling. US patent 8,575,597.

[img] ტექსტი
Restricted to მხოლოდ რეგისტრირებული მომხმარებლებისთვის

Download (831kB) | ასლის შეკვეთა
Pages from US8575597_B2.pdf

Download (95kB) | გადახედვა
ოფიციალური URL:


The use of liquid metal contacts for devices based on thermotunneling has been investigated. Electric and thermal characteristics of low wetting contact Hg/Si, and high wetting contacts Hg/Cu were determined and compared. Tunneling I-V characteristics for Hg/Si were obtained, while for Hg/Cu, I-V characteristics were ohmic. The tunneling I-V characteristic is explained by the presence of a nanogap between the contact materials. Heat conductance of high wetting and low wetting contacts were compared, using calorimeter measurements. Heat conductance of high wetting contact was 3-4 times more than of low wetting contact. Both electric and thermal characteristics of liquid metal contact indicated that it could be used for thermotunneling devices. To reduce the work function and make liquid metal more suitable for room temperature cooling, Cs was dissolved in liquid Hg. Work function as low as 2.6 eV was obtained.

ობიექტის ტიპი: პატენტი
თემატიკა: T Technology > T Technology (General)
ქვეგანყოფილება: Faculties/Schools > School of Natural Sciences and Engineering
განმათავსებელი მომხმარებელი: Professor Avtandil Tavkhelidze
განთავსების თარიღი: 08 მაისი 2014 09:29
ბოლო ცვლილება: 02 აპრილი 2015 08:04

Actions (login required)

ობიექტის ნახვა ობიექტის ნახვა