Liquid metal contact as possible element for thermotunneling

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http://eprints.org/relation/isVersionOf http://eprints.iliauni.edu.ge/id/document/8214 http://eprints.org/relation/isVolatileVersionOf http://eprints.iliauni.edu.ge/id/document/8214 http://eprints.org/relation/issmallThumbnailVersionOf http://eprints.iliauni.edu.ge/id/document/8214 archive 15 disk0/00/00/14/25 2014-05-08 09:29:05 2015-04-02 08:04:00 2014-05-08 09:29:05 patent show avtandil.tavkhelidze@iliauni.edu.ge Tavkhelidze A. avtandil.tavkhelidze@iliauni.edu.ge Liquid metal contact as possible element for thermotunneling pub T1 fac_eng restricted The use of liquid metal contacts for devices based on thermotunneling has been investigated. Electric and thermal characteristics of low wetting contact Hg/Si, and high wetting contacts Hg/Cu were determined and compared. Tunneling I-V characteristics for Hg/Si were obtained, while for Hg/Cu, I-V characteristics were ohmic. The tunneling I-V characteristic is explained by the presence of a nanogap between the contact materials. Heat conductance of high wetting and low wetting contacts were compared, using calorimeter measurements. Heat conductance of high wetting contact was 3-4 times more than of low wetting contact. Both electric and thermal characteristics of liquid metal contact indicated that it could be used for thermotunneling devices. To reduce the work function and make liquid metal more suitable for room temperature cooling, Cs was dissolved in liquid Hg. Work function as low as 2.6 eV was obtained. 2013 published US patent 8,575,597 Tavkhelidze A, Tsakadze L, Taliashvili Z, Jangidze L., Cox I http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=Tavkhelidze.INNM.&OS=IN/Tavkhelidze&RS=IN/Tavkhelidze