Vacuum nanogap formation in multilayer structures by an adhesion-controlled process

1398 16 5612 2 15640 document 5612 Vacuum nanogap formation in multilayer structures by an.pdf application/pdf c47a417b74630e26cc6b3d90891456f1 MD5 657037 2014-05-03 07:25:32 http://eprints.iliauni.edu.ge/1398/1/Vacuum%20nanogap%20formation%20in%20multilayer%20structures%20by%20an.pdf 1398 1 1 application/pdf text en validuser

Vacuum nanogap formation in multilayer structures by an.pdf

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http://eprints.org/relation/isVersionOf http://eprints.iliauni.edu.ge/id/document/5612 http://eprints.org/relation/isVolatileVersionOf http://eprints.iliauni.edu.ge/id/document/5612 http://eprints.org/relation/issmallThumbnailVersionOf http://eprints.iliauni.edu.ge/id/document/5612 8262 1 22221 document 8262 Pages from Vacuum nanogap formation in multilayer structures by an.pdf application/pdf e7d56ade529f66df60a83fc8ee3b7c9d MD5 164188 2015-04-02 08:31:42 http://eprints.iliauni.edu.ge/1398/7/Pages%20from%20Vacuum%20nanogap%20formation%20in%20multilayer%20structures%20by%20an.pdf 1398 7 7 application/pdf text ge public

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http://eprints.org/relation/isVersionOf http://eprints.iliauni.edu.ge/id/document/8262 http://eprints.org/relation/isVolatileVersionOf http://eprints.iliauni.edu.ge/id/document/8262 http://eprints.org/relation/issmallThumbnailVersionOf http://eprints.iliauni.edu.ge/id/document/8262 archive 15 disk0/00/00/13/98 2014-05-05 12:53:21 2015-04-02 08:32:04 2014-05-05 12:53:21 article show avtandil.tavkhelidze@iliauni.edu.ge Taliashvili Z. Tavkhelidze A. avtandil.tavkhelidze@iliauni.edu.ge Jangidze L. Blagidze Y. Vacuum nanogap formation in multilayer structures by an adhesion-controlled process pub T1 fac_eng restricted In this study, we regulate adhesion between thin metal films to produce a large-area vacuum nanogap for electron tunneling. Multilayer structures comprising thin metal films with adjustable adhesion were fabricated. The Cu/Ag/Ti/Si structures were grown on Si substrates and include thin Ti and Ag films and a thick Cu layer. The Ag and Ti films were deposited on the Si substrate under vacuum, and a thick Cu layer was subsequently electroplated onto the Ag surface. Later, the sandwich was separated and a vacuum nanogap was opened to produce two Ag/Cu and Ti/Si conformal electrodes. The adhesion strength between the Ti and Ag films was precisely adjusted by exposing the structures to dry O2 after Ti growth but before Ag growth. The resulting adhesion needed to be sufficiently high to allow electroplating of Cu and sufficiently low to allow subsequent separation. Either heating or cooling was used to separate the sandwiches. The structures separated as a result of the different thermal expansion parameters of the Si and Cu electrodes and the low adhesion between the Ti and Ag layers. After separation, the Ag and Ti surfaces were analyzed optically using a Michelson interferometer. Adhesion regulation and optimization of the electroplating regime allowed fabrication of two conformal electrodes with a nanogap smaller than 5 nm and an area larger than 7 mm2. Such electrodes can be used for efficient energy conversion and cooling in the mixed thermionic and thermotunneling regime. 2013 Thin Solid Films 542 Elsevier 399-403 TRUE http://dx.doi.org/10.1016/j.tsf.2013.06.089